[History and development of optical Ethernet] 10GBASE transceiver module standard transferred from XENPAK → X2 → XFP → SFP + [Net new technology] – INTERNET Watch

2022-09-23 19:08:16 By : Ms. Swing Chan

TELEC started technical standards conformity certification and construction design certification services for 6GHz band of Wi-Fi 6E and 5.2GHz band wireless equipment in automobiles.TP-Link releases Wi-Fi 5 mesh system "Deco S7" for 8,000 yen per unit.Successor to the Deco M5Regarding Ethernet or 10GBASE-T, since 2017 [10GBASE-T, finally popular?], we delivered all 11 episodes and 2 extra episodes.However, twisted pair copper wiring Ethernet is up to 10GBASE-T, and 25/40GBASE-T has not yet been put into practical use.As a matter of fact, the transceiver module standards used in 10GBASE are XENPAK → X2 → XFP → SFP+ in order of use.In March 2001, the formation of the XENPAK MSA was announced.MSA stands for MultiSource Agreement and was not even an industry association.As stated in the announcement, Agere System (a company spun out from the Microelectronics Group of the former Lucent Technologies) and Agilent Technologies have signed a joint memorandum of understanding, but anyway, these two companies are the focus. As a result, the standard proposal for the transceiver module standard for 10G Ethernet was issued.According to the announcement, it supports four wavelengths: 850nm serial, 1310nm serial, 1310nm WWDM and 1550nm serial, with module dimensions of 38 x 121 x 17.4mm.The connector utilizes a 70-pin proprietary standard (provided by Tyco Electronics).As for the power supply, a maximum of 6W can be supplied for modules with 850nm/1310nm light sources, and a maximum of 10W for modules with 1550nm light sources.However, the power supply itself is not a big problem, but the heat generation of the module due to this is more of a problem, and there is a description for that in the specification.This XENPAK was initially used because there was no other standard.However, compared to SFP, etc., it was "big" anyway, so when the X2 came out, it declined like it was pushed.The XENPAK MSA itself has been mostly inactive after issuing its Rev 3.0 specification in September 2002, and its website existed until 2008, but has since become inaccessible.In July 2002, the "X2 MSA" was formed.Members are Agere Systems, Agilent Technologies, JDS Uniphase, Mitsubishi Electric, NEC, OpNext, Optillion and Tyco Electronics.As you can see from the names of XENPAK MSA's Agere Systems and Agilent Technologies, as well as the names of Tyco Electronics, which provided connectors, it is essentially the successor standard to XENPAK.The first specification, Revision 1.0, was announced in February 2003.At this time, Ignis Optics, Molex Incorporated, Multiplex Inc, NTT, Pine Photonics, and TriQuint Optoelectronics joined as member companies, indicating that they were more active than the XENPAK MSA.Now, about the X2, the specifications themselves are quite close to XENPAK.First, the connector itself uses the same Tyco 70-pin connector as XENPAK.Regarding the electrical specifications, the values ​​of some registers of XENPAK are different (the value of the register called D.8032 changed from "00-80-BE" to "00-0C-64", the value of the register called D.8012 changed from "01" to "02"), otherwise they are completely the same.In other words, there is no difference in that it is a connection using XAUI and that it supports four wavelengths of 850nm serial / 1310nm serial / 1310nm WWDM / 1550nm serial.It's almost the same timing as the X2, but the commercialization was a little behind the X2.The ten founding members are Broadcom Corporation, Brocade, Emulex Corporation, Finisar, JDS Uniphase, Maxim Integrated Products, ONI Systems, ICS (subsidiary of Sumitomo Electric Industries), Tyco Electronics and Velio, excluding connector manufacturer Tyco and optical connector JDS Uniphase. is quite different from XENPAK/X2.However, since then, more member companies have participated, and if you look at the Contributors of XFP Revision 3.1, there are actually 75 companies listed.Most of the members of X2, such as Agere Systems, Agilent Technologies, Mitsubishi Electric, NEC, and NTT, were among them. .XFP is a standard based on "XFI".As mentioned at the end of the last article, XFI is a 10Gbps serial communication standard.That's the interface between PMA and PMD at the bottom of the slide I posted last time.And as you can see on the slide, it will be an independent standard unrelated to "IEEE 802.3ae".Perhaps because of that, XFP carefully defines this area.Basically, XFI has a structure that connects to the PMA on the host side with a two-wire system, as shown in the figure below.In addition to 10G Ethernet, SONET, 10G FiberChannel, G.709, etc. are considered for signal speed, and multiple data rates from 9.95 Gbps to 11.09 Gbps are supported.By the way, in addition to 64b/66b encoding, 8b/10b, SONET Scrambled, NRZ, and RZ formats are supported, but 10G Ethernet uses 64b/66b encoding.In the slides below, the subtle figure of 10.31 Gbps (10.3125 Gbps to be precise) for IEEE 802.3ae is because it is assumed that 64b/66b encoding is passed, so the data rate itself is 10 Gbps.It also supports various media, including 850nm VCSEL/1310nm VCSEL/1550nm VCSEL/1310 FP/1310nm DFB/1550nm DFB/1310nm EML/1550nm EML/Coppers or Others and nine types.VCSEL stands for Vertical Cavity Surface Emitting Laser, FPL stands for FP Laser, DFB stands for Distributed Feedback Laser, and EML stands for Electro Absorption Modulator Laser.As for Copper, is there a product that can withstand it?I thought, but when I looked into it, there was a product such as "XFP Twinax Cable", and it could be used for wiring in racks, for example, because it could reach up to 10m.Power supply is the toughest point compared to XENPAK/X2.In the case of XFP, four types of modules of Power Level 1 to 4 are defined.However, the power supplied is +1.8V/1.8W, +3.3V/2.5W, +5V/2.5W in the first place, and even if Power Level 4 is defined, the limit that can be used is 6.8W. Not as good as XENPAK/X2, which was capable of 10W.Freelance technical writer.His expertise spans a wide range of fields, from CPUs, memories, and chipsets to communications, OS, databases, and medical-related fields.Homepage is http://www.yusuke-ohara.com/Copyright ©2018 Impress Corporation.